Mersen aluminium Press Pack provides the maximum thermal performance in employing proprietary channeling techniques to optimize coolant velocity at low pressure drop while providing uniform temperature across the mounting surface for semiconductor reliability. It is an effective and reliable solution. Liquid cooled systems work perfectly for power electronics components, especially when installed in a confined space. Mersen is expert in vacuum brazing technology which ensure maximum reliability: guaranteed water tightness with no leak, robustness, no corrosion and excellent thermal performance. Result: a product sure to last decades!

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Quick Overview

100% aluminium (alloy)
High thermal performance (cost cutting with no derating of power module)
Low pressure drop compared to similar product
Homogeneous temperature distribution below semiconductor
Very high pressure withstanding guarantee
Perfect water tightness with no risk of leak
All cold plates systematically pressure tested at 100%
Vacuum brazing technology means no corrosion: flux free!
Long life time: >20 years guaranted
Options:
- Surface coating
- Tab for electrical connections
- Fitting as per customer requirements

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Details

Standards Vacuum-brazing technology
RoHS compliant

Application Cooling of any size of press pack semiconductor

ROHS Compliant Consult Technical Services

Lead Free Consult Technical Services

CE conformity Consult Technical Services

Additional Information

Manufacturer: Mersen